Different processes for different purposes

Is the method suitable only for the sputtering process? Initially, the partial coating tool and method were designed to form conductive patterns on a surface of substrate plate by a sputtering process. It is possible to further develop the tool to manufacture many different processes for different purposes. That is why there is no one-size-fits-all partial coating tool as the configuration depends on the performance, desired application and production requirements, which are unique. The important aspect in this process is […]