Is the method suitable only for the sputtering process?
Initially, the partial coating tool and method were designed to form conductive patterns on a surface of substrate plate by a sputtering process. It is possible to further develop the tool to manufacture many different processes for different purposes. That is why there is no one-size-fits-all partial coating tool as the configuration depends on the performance, desired application and production requirements, which are unique. The important aspect in this process is that coating small areas is more sustainable.All in all, the partial coating method has many features that can improve substrate performance or create unprecedented applications.